Ultrashort-pulse lasers

USP laser processing using a femtosecond laser

Our ultrashort-pulse fs laser processing is redefining the boundaries of microtechnology. By using femtosecond pulses, we create surface structures, cuts, and holes with a level of quality that conventional methods cannot match.

Precision without thermal effects
Ultrashort-pulse (USP) laser processing using femtosecond lasers is the high-end method for residue-free and high-precision processing of sensitive materials. KMLT^® uses this technology to create structures in the sub-micrometer range where conventional laser processes reach their thermal limits.
Due to the extremely short pulses in the femtosecond range (10^-15 s or 0.000 000 000 000 001 s), the material is directly vaporized (sublimation) before heat can be transferred to the surrounding structure. The result is “cold” processing with the highest surface quality.

KMLT® ultrashort-pulse fs laser processing

Advantages of our USP laser processing
• Thermal neutrality: No heat-affected zones, no warping, and no microstructural changes—ideal for sensitive components.
• Flawless surfaces: Burr-free cut edges and smooth structures usually eliminate the need for mechanical or chemical post-processing.
• Material versatility: We process virtually anything—from hardened steels and technical ceramics to highly sensitive polymers and composite materials.
• Geometric freedom: Realization of the smallest radii, acute angles, and complex 3D structures with tolerances in the single-digit micrometer range.

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The Comparison: Focus on Nano, Pico and Femto

In laser microprocessing, pulse duration is a key factor in determining the quality of the result. The shorter the pulse, the lower the thermal impact on the component.

Nanosecond lasers (ns): The classic

Proven for standard tasks. The longer exposure time causes the material to melt, which often requires additional work (e.g., grinding or polishing).

Pulse duration: 10^-9 s
How it works: The material is heated to its melting point and vaporized.
Result: A molten layer is formed, along with a noticeable heat-affected zone (HAZ). Mechanical or chemical post-processing (e.g., deburring) is often necessary to remove burrs.

Picosecond lasers (ps): The bridge technology

A significant improvement in precision compared to the nanosecond laser. Heat generation is already greatly reduced, offering an optimal price-performance ratio for many industrial applications.

Pulse duration: 10^-12s (one trillionth of a second).
Functionality: Virtually burr-free, significantly reduced thermal impact compared to ns lasers. The energy is delivered so rapidly that the formation of molten material is minimized.
Applications: Ideal for applications requiring high precision where the use of a femtosecond laser is not yet economically necessary.

Femtosecond laser (fs): The ultimate in USP technology at KMLT^®

The cutting edge of what is technically feasible in industrial mass production. By virtually eliminating the melting phase, we achieve maximum precision with minimal, negligible thermal stress—a critical factor for high-performance components in medical technology and micro-optics.

Pulse duration: 10^-15 s (one quadrillionth of a second).
How it works: “Cold” ablation occurs through direct sublimation. The material immediately transitions from a solid to a gaseous state without melting.
Advantage: Absolutely residue-free results, no oxidation, and the highest edge quality in the sub-micrometer range. Even the most temperature-sensitive materials or transparent substances (such as glass or polymers) can be processed perfectly.