Laser-cut precision stencils are the standard for the perfect application of solder or printing pastes, adhesives, etc. on rigid or flexible circuit boards and on other surfaces such as silicon wafers (wafer bumping), glass or ceramic substrates (LTCC).
Electronic components such as microchips, SMD components, contact elements or other semiconductor components are then automatically placed in the pre-printed pads with precisely defined volumes and thermally fused. This technology is also used in flip chip assembly.
Precision stencils from KMLT® are available in all standard formats and for all quick-release frames.
For particularly demanding applications, we also recommend electropolishing in combination with nanocoating.