Precision Stencils

Laser-cut precision stencils are the standard for the perfect application of solder or printing pastes, adhesives, etc. on rigid or flexible circuit boards and on other surfaces such as silicon wafers (wafer bumping), glass or ceramic substrates (LTCC).
Electronic components such as microchips, SMD components, contact elements or other semiconductor components are then automatically placed in the pre-printed pads with precisely defined volumes and thermally fused. This technology is also used in flip chip assembly.

Precision stencils from KMLT® are available in all common formats, electropolished for demanding applications and also with nano-coating.

  • Laser-cut metal stencils are required in the industrial production of electronic assemblies for applying solder paste to printed circuit boards.

  • Depending on the customer's technical requirements, these are usually manufactured as a frameless sheet with perforations for a quick clamping system.

  • In general, every SMD stencil produced is brushed before delivery and subjected to an optical quality check on a scanner.


Stencils for quick clamping systems